ULN2003LV datasheet(2/19 Pages) TI1

부품명	ULN2003LV

상세설명	7-Channel Relay and Inductive Load Sink Driver

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ULN2003LV

SLRS059A – APRIL 2012 – REVISED APRIL 2012

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

TA

PART NUMBER

PACKAGE

TOP-SIDE MARKING

ULN2003LVDR

16-Pin SOIC

Reel of 2500

UN2003LV

–40°C to 85°C

ULN2003LVPWR

16-Pin TSSOP

Reel of 2000

UN2003LV

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Specified at TJ = –40°C to 125°C unless otherwise noted.

VALUE

UNIT

MIN

MAX

VIN

Pins IN1- IN7 to GND voltage

–0.3

5.5

V

VOUT

Pins OUT1 – OUT7 to GND voltage

8

V

VCOM

Pin COM to GND voltage

8

V

Max GND-pin continuous current (TJ > +125°C)

700

mA

IGND

Max GND-pin continuous current (TJ < +100°C)

1.0

A

16 Pin - SOIC

0.58

W

PD

Total device power dissipation at TA = 85°C

16 Pin -TSSOP

0.45

W

ESD Rating – HBM

2

kV

ESD

ESD Rating – CDM

500

V

TA

Operating free-air ambient temperature range

–40

85

°C

TJ

Operating virtual junction temperature

–55

150

°C

Tstg

Storage temperature range

–55

150

°C

(1)

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for

extended periods may affect device reliability.

DISSIPATION RATINGS

(1) (2)

BOARD

PACKAGE

θJC

θJA

(3)

DERATING

TA < 25°C

TA = 70°C

TA = 85°C

FACTOR ABOVE

TA = 25ºC

High-K

16-Pin SOIC

69°C/W

112°C/W

8.88 mW/ºC

1.11 W

0.71 W

0.58 W

High-K

16-Pin TSSOP

74°C/W

142°C/W

7.11 mW/ºC

0.88 W

0.56 W

0.45 W

(1)

Maximum dissipation values for retaining device junction temperature of 150°C

(2)

Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance

(3)

Operating at the absolute TJ-max of 150°C can affect reliability– for higher reliability it is recommended to ensure TJ < 125°C

2

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Product Folder Link(s): ULN2003LV

유사한 부품 번호 - ULN2003LV

제조업체	부품명	데이터시트	상세설명
Allegro MicroSystems	ULN2003L	176Kb / 10P	HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON ARRAYS
Allegro MicroSystems	ULN2003L	316Kb / 11P	High Voltage High Current Darlington Arrays October 28, 2005
List of Unclassifed Man...	ULN2003L	749Kb / 8P	HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON ARRAYS
Allegro MicroSystems	ULN2003L	182Kb / 10P	HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON ARRAYS
Unisonic Technologies	ULN2003L-D16-T	328Kb / 10P	7CH DARLINGTON SINK DRIVER

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유사한 설명 - ULN2003LV

제조업체	부품명	데이터시트	상세설명
Texas Instruments	ULN2003V12	1Mb / 18P	[Old version datasheet] 7-Channel Relay and Inductive Load Sink Driver
Diodes Incorporated	ULN2003F12	448Kb / 8P	Multi-Channel Relay and Inductive Load Sink Driver
	ULN2003V12	432Kb / 8P	Multi-Channel Relay and Inductive Load Sink Driver
	DMN61D8LVTQ	349Kb / 7P	INTEGRATED RELAY AND INDUCTIVE LOAD DRIVER
ON Semiconductor	MDC3105LT1	128Kb / 12P	Integrated Relay, Inductive Load Driver March, 2004 ??Rev. 3
	NUD3105D	81Kb / 8P	Integrated Relay, Inductive Load Driver September, 2004 ??Rev. 2
	NUD3112	62Kb / 8P	Integrated Relay, Inductive Load Driver June, 2004 ??Rev. 6
	NUD3105	171Kb / 10P	Integrated Relay, Inductive Load Driver October, 2016 ??Rev. 12
	NUD3105D	164Kb / 8P	Integrated Relay, Inductive Load Driver March, 2006 ??Rev. 3
	NUD3112	75Kb / 7P	Integrated Relay, Inductive Load Driver November, 2005 ??Rev. 7

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