325705B00000G datasheet(26/116 Pages) AAVID

부품명	325705B00000G

상세설명	Channel style heat sink with folded back fins

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제조업체	AAVID [Aavid, Thermal Division of Boyd Corporation]

홈페이지	https://www.boydcorp.com/aavid.html

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26

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www.aavidthermalloy.com

FIGURE A

SMT Footprints

10.67

(0.420)

15.49

(0.610)

10.41

(0.410)

2.29

(0.090)

7.62

(0.300)

15.49

(0.610)

1.40

(0.060)

0.80

(0.030)

W

L

1

2

FIGURE B

FIGURE D

FIGURE C

L

W

16.76

(0.660)

2.54

(0.100)

10.67

(0.420)

20.32

(0.800)

2.54

(0.100)

Recommended copper heat speader drain pad footprint

Recommended heat sink solder mask opening

Note: The thickness of

the drain pad is variable

depending on the amount

of heat generated by the

SMT device, design limita-

tions and process.

Part Number

“L”

“W”

573100

9.53 (0.375)

13.97 (0.550)

573300

14.22 (0.560)

16.26 (0.640)

573400

14.22 (0.560)

21.08 (0.830)

Part Number

“L”

“W1”

“W2”

573100

9.02 (0.355)

13.46 (0.530)

8.89 (0.350)

573300

13.72 (0.540)

15.75 (0.620)

11.18 (0.440)

573400

13.72 (0.540)

20.57 (0.810)

16.00 (0.630)

Recommended copper pad size

for heat sink and device mounting footprint

For D Pak (TO-263)

For MO-184 and SO-10

Recommended copper pad size

for heat sink and device mounting footprint

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