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DAC34SH84IZAYR 데이터시트(PDF) 7 Page - Texas Instruments |
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DAC34SH84IZAYR 데이터시트(HTML) 7 Page - Texas Instruments |
7 / 77 page DAC34SH84 www.ti.com SLAS808B – FEBRUARY 2012 – REVISED JULY 2012 THERMAL INFORMATION DAC34SH84 THERMAL METRIC(1) BGA UNIT (196 ball) PINS θJA Junction-to-ambient thermal resistance(2) 37.6 °C/W θJCtop Junction-to-case (top) thermal resistance(3) 6.8 °C/W θJCbot Junction-to-case (bottom) thermal resistance(4) N/A °C/W θJB Junction-to-board thermal resistance(5) 16.8 °C/W ψJT Junction-to-top characterization parameter(6) 0.2 °C/W ψJB Junction-to-board characterization parameter(7) 16.4 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Spacer (5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (6) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (7) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Recommended operating junction temperature 105 TJ °C Maximum rated operating junction temperature(1) 125 TA Recommended free-air temperature –40 25 85 °C (1) Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): DAC34SH84 |
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