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DAC34SH84IZAYR 데이터시트(PDF) 7 Page - Texas Instruments

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부품명 DAC34SH84IZAYR
상세설명  Quad-Channel, 16-Bit, 1.5 GSPS Digital-to-Analog Converter (DAC)
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홈페이지  http://www.ti.com
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DAC34SH84
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SLAS808B – FEBRUARY 2012 – REVISED JULY 2012
THERMAL INFORMATION
DAC34SH84
THERMAL METRIC(1)
BGA
UNIT
(196 ball) PINS
θJA
Junction-to-ambient thermal resistance(2)
37.6
°C/W
θJCtop
Junction-to-case (top) thermal resistance(3)
6.8
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance(4)
N/A
°C/W
θJB
Junction-to-board thermal resistance(5)
16.8
°C/W
ψJT
Junction-to-top characterization parameter(6)
0.2
°C/W
ψJB
Junction-to-board characterization parameter(7)
16.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
(5)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(6)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(7)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
Recommended operating junction temperature
105
TJ
°C
Maximum rated operating junction temperature(1)
125
TA
Recommended free-air temperature
–40
25
85
°C
(1)
Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate.
Copyright © 2012, Texas Instruments Incorporated
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