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SM320C6455-EP 데이터시트(PDF) 11 Page - Texas Instruments |
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SM320C6455-EP 데이터시트(HTML) 11 Page - Texas Instruments |
11 / 254 page www.ti.com 2 Device Overview 2.1 Device Characteristics SM320C6455-EP FIXED-POINT DIGITAL SIGNAL PROCESSOR SPRS462B – SEPTEMBER 2007 – REVISED JANUARY 2008 Table 2-1, provides an overview of the C6455 DSP. The tables show significant features of the C6455 device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count. Table 2-1. Characteristics of the C6455 Processor HARDWARE FEATURES C6455 EMIFA (64 bit bus width) 1 (clock source = AECLKIN or SYSCLK4) DDR2 Memory Controller (32 bit bus width) [1.8 V I/O] 1 (clock source = CLKIN2) EDMA3 (64 independent channels) [CPU/3 clock rate] 1 High-speed 1x/4x Serial Rapid IO Port 1 I2C 1 Peripherals HPI (32- or 16 bit user selectable) 1 (HPI16 or HPI32) Not all peripherals pins are available at the same PCI (32 bit), [66-MHz or 33-MHz] 1 (PCI66 or PCI33) time (For more detail, see McBSPs (internal CPU/6 or external clock source up the Device Configuration 2 to 100 Mbps) section). UTOPIA (8 bit mode, 50-MHz, Slave-only) 1 10/100/1000 Ethernet MAC (EMAC) 1 Management Data Input/Output (MDIO) 1 64 Bit Timers (Configurable) 2 64 bit or 4 32 bit (internal clock source = CPU/6 clock frequency) General-Purpose Input/Output Port (GPIO) 16 VCP2 (clock source = CPU/3 clock frequency) 1 Decoder Coprocessors TCP2 (clock source = CPU/3 clock frequency) 1 Size (Bytes) 2192K 32K-Byte (32KB) L1 Program Memory Controller [SRAM/Cache] On-Chip Memory Organization 32KB Data Memory Controller [SRAM/Cache] 2096KB L2 Unified Memory/Cache 32KB L2 ROM C64x+ Megamodule Megamodule Revision ID Register (address location: See Section 5.6, Megamodule Revision Revision ID 0181 2000h) See Section 3.6, JTAG ID (JTAGID) Register JTAG BSDL_ID JTAGID register (address location: 0x02A80008) Description Frequency MHz 720, 850, 1000 (1 GHz), and 1200 (1.2 GHz) 1.39 ns (C6455-720), 1.17 ns (C6455-850), Cycle Time ns 1 ns (C6455 A-1000, -1000) [1-GHz CPU](1) 0.83 ns (C6455-1200) [1.2-GHz CPU] 1.25 V (A-1000/-1000/-1200) Core (V) 1.2 V (-850/-720) Voltage 1.25/1.2 [RapidIO], I/O (V) 1.5/1.8 [EMAC RGMII], and 1.8 and 3.3 V [I/O Supply Voltage] PLL1 and PLL1 CLKIN1 frequency multiplier Bypass (x1), x15, x20, x25, x30, x32 Controller Options CLKIN2 frequency multiplier PLL2 x20 [DDR2 Memory Controller and EMAC support only] 697-Pin Flip-Chip Plastic BGA (ZTZ) BGA Package 24 x 24 mm 697-Pin Flip-Chip Plastic BGA (GTZ) (1) The extended temperature device's (A-1000) electrical characteristics and ac timings are the same as those for the corresponding commercial temperature devices (-1000). Submit Documentation Feedback Device Overview 11 |
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