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AD606JR-REEL7 데이터시트(PDF) 3 Page - Analog Devices |
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AD606JR-REEL7 데이터시트(HTML) 3 Page - Analog Devices |
3 / 12 page AD606 REV. B –3– ORDERING GUIDE Temperature Package Package Model Range Description Option AD606JN 0 °C to +70°C 16-Lead Plastic DIP N-16 AD606JR 0 °C to +70°C 16-Lead Narrow-Body R-16A SOIC AD606JR-REEL 0 °C to +70°C 13" Tape and Reel R-16A AD606JR-REEL7 0 °C to +70°C 7" Tape and Reel R-16A AD606-EB Evaluation Board AD606JCHIPS 0 °C to +70°C Die PIN DESCRIPTION Plastic DIP (N) and Small Outline (R) Packages TOP VIEW (Not to Scale) 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 INLO INHI AD606 COMM COMM ISUM PRUP ILOG VPOS BFIN FIL1 VLOG FIL2 OPCM LADJ LMLO LMHI ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage VPOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . +9 V Internal Power Dissipation 2 . . . . . . . . . . . . . . . . . . . 600 mW Operating Temperature Range . . . . . . . . . . . . . 0 °C to +70°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air: 16-Lead Plastic DIP Package: θ JA = 85°C/W 16-Lead SOIC Package: θ JA = 100°C/W CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD606 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. PIN FUNCTION DESCRIPTIONS Pin Mnemonic Function 1 INLO DIFFERENTIAL RF INPUT –75 dBm to +5 dBm, Inverting, AC Coupled. 2 COMM POWER SUPPLY COMMON Connect to Ground. 3 ISUM LOG DETECTOR SUMMING NODE 4 ILOG LOG CURRENT OUTPUT Normally No Connection; 2 µA/dB Output Current. 5 BFIN BUFFER INPUT Optionally Used to Realize Low Frequency Post-Demodulation Filters. 6 VLOG BUFFERED LOG OUTPUT 37.5 mV/dB (100 mV to 4.5 V). 7 OPCM OUTPUT COMMON Connect to Ground. 8 LMLO DIFFERENTIAL LIMITER OUTPUT 1.2 mA Full-Scale Output Current. Open Collector Output Must Be “Pulled” Up to VPOS with R ≤ 400 Ω. 9 LMHI DIFFERENTIAL LIMITER OUTPUT 1.2 mA Full-Scale Output Current. Open Collector Output Must Be “Pulled” Up to VPOS with R ≤ 400 Ω. 10 LADJ LIMITER LEVEL ADJUSTMENT Optionally Used to Adjust Limiter Output Current. 11 FIL1 OFFSET LOOP LOW-PASS FILTER Normally No Connection; a Capacitor Between FIL1 and FIL2 May Be Added to Lower the Filter Cutoff Frequency. 12 FIL2 OFFSET LOOP LOW-PASS FILTER Normally No Connection; See Above. 13 VPOS POSITIVE SUPPLY Connect to +5 V at 13 mA. 14 PRUP POWER UP CMOS (5 V) Logical High = Device On ( ≈ 65 mW). CMOS (0 V) Logical Low = Device Off ( ≈ 325 µW). 15 COMM POWER SUPPLY COMMON Connect to Ground. 16 INHI DIFFERENTIAL RF INPUT –75 dBm to +5 dBm, Noninverting, AC-Coupled. WARNING! ESD SENSITIVE DEVICE |
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