AD7396/AD7397

–5–

REV. 0

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7396/AD7397 features proprietary ESD protection circuitry, permanent dam-

age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper

ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ABSOLUTE MAXIMUM RATINGS*

Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V

AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +2 V

θ

JA

Thermal Resistance

θ

JA

24-Lead Plastic DIP Package (N-24) . . . . . . . . . . +63

°C/W

24-Lead SOIC Package (R-24) . . . . . . . . . . . . . . . +70

°C/W

24-Lead Thin Shrink Surface Mount (RU-24) . . +143

°C/W

ORDERING GUIDE

Res

Temperature

Package

Package

Model

(LSB)

Ranges

Descriptions

Options

AD7396AN

12

–40

°C to +85°C

24-Lead P-DIP

N-24

AD7396AR

12

–40

°C to +85°C

24-Lead SOIC

R-24

AD7397AN

10

–40

°C to +125°C

24-Lead P-DIP

N-24

AD7397AR

10

–40

°C to +125°C

24-Lead SOIC

R-24

AD7397ARU

10

–40

°C to +85°C

24-Lead Thin Shrink Small Outline Package (TSSOP)

RU-24

The AD7396/AD7397 contains 1365 transistors. The die size measures 89 mil

× 106 mil = 9434 sq mil.

°C

Operating Temperature Range . . . . . . . . . . . –40

°C to +85°C

AD7397AN, AD7397AR Only . . . . . . . . –40

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature

N-24 (Soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . +300

°C

R-24 (Vapor Phase, 60 sec) . . . . . . . . . . . . . . . . . . . . +215

°C

RU-24 (Infrared, 15 sec) . . . . . . . . . . . . . . . . . . . . . . +224

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.