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FAN3241TMX 데이터시트(PDF) 2 Page - Fairchild Semiconductor

부품명 FAN3241TMX
상세설명  The FAN324x family includes dual high-current relay drivers designed to drive dual-coil polarized latching...
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제조업체  FAIRCHILD [Fairchild Semiconductor]
홈페이지  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

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© 2011 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN3240 • Rev. 0.1.5
2
Ordering Information
Part
Number
Minimum Input
Time
Maximum Pulse
Width
Package
Packing
Method
Reel
Quantity
FAN3240TMX
15 ms
150 ms
SOIC-8
Tape & Reel
2,500
FAN3241TMX
1 ms
30 ms
SOIC-8
Tape & Reel
2,500
All standard Fairchild Semiconductor products are RoHS compliant and many are also “GREEN” or going green. For Fairchild’s
definition of “green” please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Package Outline
Figure 2.
SOIC-8 (Top View)
Thermal Characteristics
(1)
Package
ΘJL
(2)
ΘJT
(3)
ΘJA
(4)
ΨJB
(5)
ΨJT
(6)
Unit
8-Pin, Small-Outline Integrated Circuit (SOIC)
40
31
89
43
3.0
°C/W
Notes:
1.
Estimates derived from thermal simulation; actual values depend on the application.
2.
Theta_JL (
ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any
thermal pad) that are typically soldered to a PCB.
3.
Theta_JT (
ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is
held at a uniform temperature by a top-side heatsink.
4.
Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow.
The value given is for natural convection with no heatsink, as specified in JEDEC standards JESD51-2, JESD51-5, and
JESD51-7, as appropriate.
5.
Psi_JB (
ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an
application circuit board reference point for the thermal environment defined in Note 4. For the MLP-8 package, the board
reference is defined as the PCB copper connected to the thermal pad and protruding from either end of the package. For the
SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
6.
Psi_JT (
ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction temperature and
the center of the top of the package for the thermal environment defined in Note 4.


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