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74VCXH16374 ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 1 Page - Fairchild Semiconductor

๋ถ€ํ’ˆ๋ช… 74VCXH16374
์ƒ์„ธ๋‚ด์šฉ  Low Voltage 16-Bit D-Type Flip-Flop with Bushold
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์ œ์กฐ์‚ฌ  FAIRCHILD [Fairchild Semiconductor]
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74VCXH16374 ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 1 Page - Fairchild Semiconductor

 
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ยฉ 2005 Fairchild Semiconductor Corporation
DS500228
www.fairchildsemi.com
January 2000
Revised June 2005
74VCXH16374
Low Voltage 16-Bit D-Type Flip-Flops with Bushold
General Description
The VCXH16374 contains sixteen non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and output enable (OE) are common to
each byte and can be shorted together for full 16-bit opera-
tion.
The VCXH16374 data inputs include active bushold cir-
cuitry, eliminating the need for external pull-up resistors to
hold unused or floating data inputs at a valid logic level.
The 74VCXH16374 is designed for low voltage (1.4V to
3.6V) VCC applications with output compatibility up to 3.6V.
The 74VCXH16374 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing low CMOS power dissipation.
Features
s 1.4V to 3.6V VCC supply operation
s 3.6V tolerant control inputs and outputs
s Bushold on data inputs eliminates the need for external
pull-up/pull-down resistors
s tPD
3.0 ns max for 3.0V to 3.6V VCC
s Static Drive (IOH/IOL)
r24 mA @ 3.0V VCC
s Uses patented noise/EMI reduction circuitry
s Latch-up performance exceeds 300 mA
s ESD performance:
Human body model
! 2000V
Machine model
! 200V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Note 1: BGA package available in Tape and Reel only.
Note 2: Devices also available in Tape and Reel. Specify by appending suffix letter โ€œXโ€ to the ordering code.
Logic Symbol
Order Number
Package Number
Package Descriptions
74VCXH16374GX
(Note 1)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74VCXH16374MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide


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