Datasheet

9/15

BDxxKA5 Series

BDxxKA5W Series

BD00KA5W Series

TSZ02201-0R6R0A600150-1-2

© 2012 ROHM Co., Ltd. All rights reserved.

www.rohm.com

TSZ22111･15･001

26.Jun.2012 Rev.001

●I/O equivalence circuit

●Power Dissipation

When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.

The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the

consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal

Even when the ambient temperature Ta is a normal temperature (25℃), the chip(junction) temperature Tj may be quite high,

so please operate the IC at temperatures less than the acceptable loss Pd.

※

With BD00KA5WFP/WF,R1and R2 are connected

outside the IC between ADJ and GND and

between OUT and

ADJ.

CTL

Vcc Vcc

Vcc

OUT

ADJ

R1

R2

31.25kΩ 2kΩ

25kΩ

(BD00KA5WFP/WF)

Fig.18

Fig.19

Vcc

Fig.20 Power Dissipation heat

reducing characteristics

TO252-5

0.0

0.4

0.8

1.2

1.6

2.0

0

25

50

75

100

125

150

Ambient temperature：Ta(℃)

1.30

Rohm standard board mounting

Board size：70×70×1.6ｍｍ

Copper foil area：7×7ｍｍ

2

θja=96.2(℃/W)

TO252-3

Fig.21 Power Dissipation heat

reducing characteristics

0.0

0.4

0.8

1.2

1.6

2.0

0

25

50

75

100

125

150

周囲温度：Ta(℃)

1.20

Rohm standard board mounting

Board size：70×70×1.6ｍｍ

Copper foil area：7×7ｍｍ

2

θja=104.2(℃/W)

Ambient temperature：Ta(℃)

SOP8

Fig.22 Power Dissipation heat

reducing characteristics

0

200

400

600

800

1000

0

25

50

75

100

125

150

周囲温度：Ta(℃)

687.6mW

562.6mW

(1)

(2)

(1)When using a standard board:

θj-c=181.8(℃/W)

(2) When using an IC alone

θj-a=222.2(℃/W)

Ambient temperature：Ta(℃)