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DAC7545GLU 데이터시트(PDF) 2 Page - Burr-Brown (TI) |
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DAC7545GLU 데이터시트(HTML) 2 Page - Burr-Brown (TI) |
2 / 12 page DAC7545 2 SBAS150A www.ti.com ABSOLUTE MAXIMUM RATINGS(1) T A = +25°C, unless otherwise noted. VDD to DGND ........................................................................... –0.3V, +17 Digital Input to DGND ............................................................... –0.3V, VDD VRFB, VREF, to DGND ........................................................................ ±25V VPIN 1 to DGND ........................................................................ –0.3V, VDD AGND to DGND ........................................................................ –0.3V, VDD Power Dissipation: Any Package to +75 °C .................................... 450mW Derates above +75 °C by ................................ 6mW/°C Operating Temperature: Commercial J, K, L, and GL ........................................... –40 °C to +85°C Storage Temperature ...................................................... –65 °C to +150°C Lead Temperature (soldering, 10s) ............................................... +300 °C NOTE: (1) Stresses above those listed above may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other condition above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. SPECIFIED RELATIVE GAIN ERROR (LSB) PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT PRODUCT ACCURACY (LSB) VDD = +5V PACKAGE-LEAD DESIGNATOR(1) RANGE MARKING NUMBER MEDIA, QUANTITY DAC7545 ±2 ±20 SO-20 DW –40 °C to +85°C DAC7545JU DAC7545JU Rails, 38 " ±1 ±10 " " " DAC7545KU DAC7545KU Rails, 38 DAC7545 ±1/2 ±5 SO-20 DW –40 °C to +85°C DAC7545LU DAC7545LU Rails, 38 " ±1/2 ±2 " " " DAC7545GLU DAC7545GLU Rails, 38 NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com. PACKAGE/ORDERING INFORMATION PIN CONNECTIONS DAC7545 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 OUT 1 AGND DGND (MSB) DB 11 DB 10 DB 9 DB 8 DB 7 DB 6 DB 5 R FB V REF V DD WR CS DB 0 (LSB) DB 1 DB 2 DB 3 DB 4 Top View SO WRITE CYCLE TIMING DIAGRAM Mode Selection Write Mode Hold Mode CS and WR low, DAC responds Either CS or WR high, data bus to Data Bus (DB0-DB11) inputs. (DB0-DB11) is locked out; DAC holds last data present when WR or CS assumed high state. NOTES: VDD = +5V, tR = tF = 20ns. VDD = +15V, tR = tF = 40ns. All inputs signal rise and fall times measured from 10% to 90% of VDD. Timing measurement reference level is (VIH + VIL)/2. t DS t DH V IH V IL Data Valid V DD 0 t WR t CS t CH V DD 0 V DD 0 Data In (DB 0-DB11) WR CS |
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