4

Package Outline Drawing

HCPL-0710 Outline Drawing (Small Outline SO-8 Package)

Solder Reflow Thermal Profile

Recommended reflow condition as per JEDEC Standard,

J-STD-020 (latest revision). Non-Halide Flux should be

used.

XXXV

YWW

8

7

6

5

4

3

2

1

5.994 ± 0.203

(0.236 ± 0.008)

3.937 ± 0.127

(0.155 ± 0.005)

0.406 ± 0.076

(0.016 ± 0.003)

1.270

(0.050)

BSC

5.080 ± 0.127

(0.200 ± 0.005)

3.175 ± 0.127

(0.125 ± 0.005)

1.524

(0.060)

45° X 0.432

(0.017)

0.228 ± 0.025

(0.009 ± 0.001)

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

0.305

(0.012)

MIN.

TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

5.207 ± 0.254 (0.205 ± 0.010)

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

OPTION NUMBER 500 NOT MARKED.

NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.

0.203 ± 0.102

(0.008 ± 0.004)

7°

PIN ONE

0 ~ 7°

*

*

7.49 (0.295)

1.9 (0.075)

0.64 (0.025)

LAND PATTERN RECOMMENDATION

Regulatory Information

The HCPL-x710 have been approved by the following organizations:

IEC/EN/DIN EN 60747-5-5

UL

Recognized under UL 1577, component recognition

program, File E55361.

CSA

Approved under CSA Component Acceptance Notice

#5, File CA 88324.