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LM2940IMPX-5.0 데이터시트(PDF) 3 Page - Texas Instruments |
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LM2940IMPX-5.0 데이터시트(HTML) 3 Page - Texas Instruments |
3 / 35 page LM2940-N, LM2940C www.ti.com SNVS769I – MARCH 2000 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) LM2940-N KTT, NFE, NAC, NDE, DCY ≤ 100 ms 60V LM2940C KTT, NDE ≤ 1 ms 45V Internal Power Dissipation(3) Internally Limited Maximum Junction Temperature 150°C Storage Temperature Range −65°C ≤ TJ ≤ +150°C TO-220 (NDE), Wave 260°C, 10s DDPAK/ TO-263 (KTT) 235°C, 30s Soldering Temperature (4) SOT-223 (DCY) 260°C, 30s WSON-8 (NGN) 235°C, 30s ESD Susceptibility (5) 2 kV (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ, the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. The value of θJA (for devices in still air with no heatsink) is 60°C/W for the TO-220 package, 80°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. The effective value of θJA can be reduced by using a heatsink (see Application Hints for specific information on heatsinking). The value of θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. (4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperature and time are for Sn-Pb (STD) only. (5) ESD rating is based on the human body model, 100 pF discharged through 1.5 k Ω. Operating Conditions (1) Input Voltage 26V LM2940-N NDE, LM2940-N KTT −40°C ≤ TJ ≤ 125°C LM2940C NDE, LM2940C KTT 0°C ≤ TJ ≤ 125°C Temperature Range LM2940-N DCY −40°C ≤ TA ≤ 85°C LM2940-N NFE, LM2940-N NAC −55°C ≤ TJ ≤ 125°C LM2940-N NGN −40°C ≤ TJ ≤ 125°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical Characteristics. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2940-N LM2940C |
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