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AD8206YRZ 데이터시트(PDF) 6 Page - Analog Devices |
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AD8206YRZ 데이터시트(HTML) 6 Page - Analog Devices |
6 / 16 page AD8206 Data Sheet Rev. B | Page 6 of 16 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 2. Metallization Diagram NC = NO CONNECT AD8206 TOP VIEW (Not to Scale) –IN 1 GND 2 VREF2 3 NC 4 +IN VREF1 V+ OUT 8 7 6 5 Figure 3. Pin Configuration Table 3. Pin Function Descriptions Pin No. Mnemonic X Y 1 −IN −209 +486 2 GND −447 +34 3 VREF2 −432 −480 4 NC N/A N/A 5 OUT +444 −495 6 V+ +444 −227 7 VREF1 +456 +342 8 +IN +207 +486 Die size is 1245 µm by 1400 µm. Die thickness is 13 mil. Minimum passivation opening (minimum bond pad size) is 92 µm × 92 µm. Passivation type is 8KA USG (Oxide) + 10KA Oxynitride. Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu. Backside potential is V+. |
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