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ADMP510ACEZ-RL 데이터시트(PDF) 9 Page - Analog Devices |
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ADMP510ACEZ-RL 데이터시트(HTML) 9 Page - Analog Devices |
9 / 12 page Data Sheet ADMP510 Rev. 0 | Page 9 of 12 HANDLING INSTRUCTIONS PICK-AND-PLACE EQUIPMENT The MEMS microphone can be handled using standard pick- and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: • Use a standard pickup tool to handle the microphone. Because the microphone hole is located on the bottom surface of the package (see Figure 2), the pickup tool can make contact with any part of the top lid surface. • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. • Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 3 and Table 3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. |
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