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LM22675 데이터시트(PDF) 4 Page - Texas Instruments |
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LM22675 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 23 page LM22675 SNVS591K – SEPTEMBER 2008 – REVISED MARCH 2013 www.ti.com Electrical Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TA = TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified: VIN = 12V. Min Typ Max Parameter Test Conditions Units (1) (2) (1) LM22675-5.0 VFB Feedback Voltage VIN = 8V to 42V 4.925/4.9 5.0 5.075/5.1 V LM22675-ADJ VFB Feedback Voltage VIN = 4.7V to 42V 1.266/1.259 1.285 1.304/1.311 V All Output Voltage Versions IQ Quiescent Current VFB = 5V 3.4 6 mA ISTDBY Standby Quiescent Current EN Pin = 0V 25 40 µA ICL Current Limit 1.3/1.2 1.5 1.7/1.8 A IL Output Leakage Current VIN = 42V, EN Pin = 0V, VSW = 0V 0.2 2 µA VSW = -1V 0.1 3 µA RDS(ON) Switch On-Resistance 0.2 0.24/0.32 Ω fO Oscillator Frequency 400 500 600 kHz TOFFMIN Minimum Off-time 100 200 300 ns TONMIN Minimum On-time 100 ns IBIAS Feedback Bias Current VFB = 1.3V (ADJ Version Only) 230 nA VEN Enable Threshold Voltage Falling 1.3 1.6 1.9 V VENHYST Enable Voltage Hysteresis 0.6 V IEN Enable Input Current EN Input = 0V 6 µA TSD Thermal Shutdown Threshold 150 °C θJA Thermal Resistance MR package, Junction to ambient 60 °C/W thermal resistance (3) (1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Ti's Average Outgoing Quality Level (AOQL). (2) Typical values represent most likely parametric norms at the conditions specified and are not ensured. (3) The value of θJA for the SO PowerPAD-8 exposed pad package of 60°C/W is valid if package is mounted to 1 square inch of copper. The θJA value can range from 42 to 115°C/W depending on the amount of PCB copper dedicated to heat transfer. 4 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Product Folder Links: LM22675 |
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