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LM2937IMP-10 데이터시트(PDF) 6 Page - Texas Instruments

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부품명 LM2937IMP-10
상세설명  LM2937 500 mA Low Dropout Regulator
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LM2937
SNVS100E – MARCH 2000 – REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Line Transient Response
Load Transient Response
Figure 11.
Figure 12.
Ripple Rejection
Output Impedance
Figure 13.
Figure 14.
Maximum Power Dissipation (TO-220)
Maximum Power Dissipation (DDPAK/TO-263)(1)
Figure 15.
Figure 16.
(1)
The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction
temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance
θJA is 65°C/W, for the
TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink,
θJA is
the sum of the LM2937 junction-to-case thermal resistance
θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the
DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package (see Application Hints for more information on heatsinking).
6
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