전자부품 데이터시트 검색엔진 |
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ADMP411ACEZ-RL7 데이터시트(PDF) 8 Page - Analog Devices |
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ADMP411ACEZ-RL7 데이터시트(HTML) 8 Page - Analog Devices |
8 / 12 page ADMP411 Data Sheet Rev. 0 | Page 8 of 12 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick and place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. • Do not pull air out or blow air into the microphone port. • Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 3 and Table 3. For more detailed recommendations, see the AN-1068 Application Note, Reflow Soldering of the MEMS Microphone. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Blowoff procedures and ultrasonic cleaning must not be used. |
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