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2SC4095 데이터시트(PDF) 7 Page - Renesas Technology Corp |
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2SC4095 데이터시트(HTML) 7 Page - Renesas Technology Corp |
7 / 10 page 5 2SC4095 RECOMMENDED SOLDERING CONDTITIONS The following conditions (see table below) must be met then soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different contions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SMT MANUAL” (IEI-1207). 2SC4095 Soldering process Soldering conditions Symbol Infrared ray reflow Peak package’s surface temperature: 230 C or below, Reflow time: 30 seconds or below (210 C or higher), Number of reflow process: 1, Exposure limit*: None IR30-00-1 VPS Peak package’s surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), Number of reflow process: 1, Exposure limit*: None VP15-00-1 Wave soldering Solder temperature: 260 C or below, Flow time: 10 seconds or below, Number of reflow process: 1, Exposure limit*: None WS60-00-1 Partial heating method Terminal temperature: 300 C or below, Flow time: 3 seconds or below, Exposure limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for “Partial heating method”. |
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