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2SC4095 데이터시트(PDF) 7 Page - Renesas Technology Corp

부품명 2SC4095
상세설명  MICROWAVE LOW NOISE AMPLIFIER NPN SILICON EPITAXIAL TRANSISTOR
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제조업체  RENESAS [Renesas Technology Corp]
홈페이지  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

2SC4095 데이터시트(HTML) 7 Page - Renesas Technology Corp

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2SC4095
RECOMMENDED SOLDERING CONDTITIONS
The following conditions (see table below) must be met then soldering this product. Please consult with our sales
offices in case other soldering process is used, or in case soldering is done under different contions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “SMT MANUAL” (IEI-1207).
2SC4095
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package’s surface temperature: 230
C or below,
Reflow time:
30 seconds or below (210
C or higher),
Number of reflow process:
1, Exposure limit*: None
IR30-00-1
VPS
Peak package’s surface temperature: 215
C or below,
Reflow time:
40 seconds or below (200
C or higher),
Number of reflow process:
1, Exposure limit*: None
VP15-00-1
Wave soldering
Solder temperature:
260
C or below,
Flow time:
10 seconds or below,
Number of reflow process:
1, Exposure limit*: None
WS60-00-1
Partial heating method
Terminal temperature:
300
C or below,
Flow time:
3 seconds or below,
Exposure limit*:
None
*: Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25
C and relative humidity at 65 % or less.
Note: Do not apply more than a single process at once, except for “Partial heating method”.


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