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FAN48610BUC50X 데이터시트(PDF) 3 Page - Fairchild Semiconductor |
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FAN48610BUC50X 데이터시트(HTML) 3 Page - Fairchild Semiconductor |
3 / 13 page © 2013 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN48610 • Rev. 1.0.0 • 3 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VIN Voltage on VIN Pin -0.3 6.0 V VOUT Voltage on VOUT Pin 6.0 V SW SW Node DC -0.3 6.0 V Transient: 10 ns, 3 MHz -1.0 8.0 Voltage on Other Pins -0.3 6.0 (3) V ESD Electrostatic Discharge Protection Level Human Body Model per JESD22-A114 5 kV Charged Device Model per JESD22-C101 2 TJ Junction Temperature -40 +150 °C TSTG Storage Temperature -65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Note: 3. Lesser of 6.0 V or VIN + 0.3 V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Max. Unit VIN Supply Voltage 2.5 4.5 V IOUT Maximum Output Current 1000 mA TA Ambient Temperature -40 +85 °C TJ Junction Temperature -40 +125 °C Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p boards with vias in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature, TJ(max), at a given ambient temperature, TA. Symbol Parameter Typical Unit ϴJA Junction-to-Ambient Thermal Resistance 50 °C/W |
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