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MTV25N50E 데이터시트(PDF) 1 Page - Motorola, Inc

부품명 MTV25N50E
상세설명  TMOS POWER FET 25 AMPERES 500 VOLTS RDS(on) = 0.200 OHM
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제조업체  MOTOROLA [Motorola, Inc]
홈페이지  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

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Motorola TMOS Power MOSFET Transistor Device Data
Advance Information
TMOS E-FET.
Power Field Effect Transistor
D3PAK for Surface Mount
N–Channel Enhancement–Mode Silicon Gate
The D3PAK package has the capability of housing the largest chip
size of any standard, plastic, surface mount power semiconductor.
This allows it to be used in applications that require surface mount
components with higher power and lower RDS(on) capabilities. This
high voltage MOSFET uses an advanced termination scheme to
provide enhanced voltage–blocking capability without degrading
performance over time. In addition, this advanced TMOS E–FET is
designed to withstand high energy in the avalanche and commuta-
tion modes. The new energy efficient design also offers a drain–to–
source diode with a fast recovery time. Designed for high voltage,
high speed switching applications in surface mount PWM motor
controls and both ac–dc and dc–dc power supplies. These devices
are particularly well suited for bridge circuits where diode speed and
commutating safe operating areas are critical and offer additional
safety margin against unexpected voltage transients.
• Robust High Voltage Termination
• Avalanche Energy Specified
• Source–to–Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature
• Short Heatsink Tab Manufactured – Not Sheared
• Specifically Designed Leadframe for Maximum Power Dissipation
• Available in 24 mm, 13–inch/500 Unit Tape & Reel, Add –RL Suffix to Part Number
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain–to–Source Voltage
VDSS
500
Vdc
Drain–to–Gate Voltage (RGS = 1.0 MΩ)
VDGR
500
Vdc
Gate–to–Source Voltage — Continuous
VGS
±20
Vdc
Drain Current — Continuous
Drain Current — Continuous @ 100
°C
Drain Current — Single Pulse (tp ≤ 10 µs)
ID
ID
IDM
25
15.8
88
Adc
Apk
Total Power Dissipation
Derate above 25
°C
PD
250
2.0
Watts
W/
°C
Operating and Storage Temperature Range
TJ, Tstg
– 55 to 150
°C
Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C
(VDD = 100 Vdc, VGS = 10 Vdc, Peak IL = 25 Apk, L = 3.0 mH, RG = 25 Ω )
EAS
938
mJ
Thermal Resistance — Junction to Case
Thermal Resistance — Junction to Ambient
Thermal Resistance — Junction to Ambient (1)
R
θJC
R
θJA
R
θJA
0.5
62.5
35
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8
″ from case for 10 seconds
TL
260
°C
(1) When surface mounted to an FR4 board using the minimum recommended pad size.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
E–FET is a trademark of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.
Order this document
by MTV25N50E/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
CASE 433–01, Style 2
D3PAK Surface Mount
MTV25N50E
TMOS POWER FET
25 AMPERES
500 VOLTS
RDS(on) = 0.200 OHM
®
D
S
G
N–Channel
© Motorola, Inc. 1996


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