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TS68882MF25 데이터시트(PDF) 8 Page - ATMEL Corporation |
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TS68882MF25 데이터시트(HTML) 8 Page - ATMEL Corporation |
8 / 43 page 8 TS68882 2119A–HIREL–04/02 Thermal Characteristics Power Considerations The average chip-junction temperature, TJ, in °C can be obtained from: TJ =TA +(PD + θJA)(1) TA = Ambient Temperature, °C θ JA = Package Thermal Resistance, Junction-to-Ambient, °C/W PD =PINT +PI/O PINT =ICC xVCC, Watts - Chip Internal Power PI/O = Power Dissipation on Input and Output Pins - User Determined For most applications PI/O <PINT and can be neglected. An Approximate relationship between PD and TJ (if PI/O is neglected) is: PD =K: (TJ + 273) (2) Solving equations (1) and (2) for K gives K= PD.(TA +273) + θJA · PD 2 (3) where K is constant pertaining to the particular part K can be determined from the equa- tion (3) by measuring PD (at equilibrium) for a known TA.Using this value ofK,the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA. The total thermal resistance of a package ( θ JA) can be separated into two components, θ JC and θCA, representing the barrier to heat flow from the semiconductor junction to the package (case), surface ( θ JC) and from the case to the outside ambient (θCA). These terms are related by the equation: θ JA = θJC + θCA (4) θ JA is device related and cannot be influenced by the user. However, θCA is user depen- dent and can be minimized by such thermal management techniques as heat sinks, ambient air cooling and thermal convection. Thus, good thermal management on the part of the user can significantly reduce θ CA so that θJA approximately equals θJC. Substi- tution of θ JC for θJA in equa tio n (1 ) wil l result i n a l ower semi co nductor j uncti on temperature. Table 4. Package Symbol Parameter Value Rating PGA 68 θ JA Thermal Resistance - Ceramic Junction To Ambient 33 °C/W θ JC Thermal Resistance - Ceramic Junction To Case 4 °C/W CQFP θ JA Thermal Resistance - Ceramic Junction To Ambient 33 °C/W θ JC Thermal Resistance - Ceramic Junction To Case 3 °C/W |
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