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BS616LV2013 ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 7 Page - Brilliance Semiconductor

๋ถ€ํ’ˆ๋ช… BS616LV2013
์ƒ์„ธ๋‚ด์šฉ  Very Low Power/Voltage CMOS SRAM 128K X 16 bit
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Revision 2.5
April 2002
7
R0201-BS616LV2013
BSI
BS616LV2013
WRITE CYCLE2 (1,6)
t WC
t CW
(11)
(2)
t WP
t AW
t WHZ
(4,10)
t AS
t WR
(3)
t DH
t DW
D
IN
D
OUT
WE
CE
ADDRESS
(5)
t DH
(7)
(8)
(8,9)
t BW
LB,UB
NOTES:
1. WE must be high during address transitions.
2. The internal write time of the memory is defined by the overlap of CE and WE low. All signals
must be active to initiate a write and any one signal can terminate a write by going inactive.
The data input setup and hold timing should be referenced to the second transition edge of
the signal that terminates the write.
3. TWR is measured from the earlier of CE or WE going high at the end of write cycle.
4. During this period, DQ pins are in the output state so that the input signals of opposite phase
to the outputs must not be applied.
5. If the CE low transition occurs simultaneously with the WE low transitions or after the WE
transition, output remain in a high impedance state.
6. OE is continuously low (OE = VIL ).
7. DOUT is the same phase of write data of this write cycle.
8. DOUT is the read data of next address.
9. If CE is low during this period, DQ pins are in the output state. Then the data input signals of
opposite phase to the outputs must not be applied to them.
10. Transition is measured
500mV from steady state with CL = 5pF as shown in Figure 1B.
The parameter is guaranteed but not 100% tested.
11. TCW is measured from the later of CE going low to the end of write.
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