74HC_HCT244

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Product data sheet

Rev. 4 — 24 September 2012

3 of 18

NXP Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

5.

Pinning information

5.1 Pinning

5.2 Pin description

(1) This is not a supply pin. The substrate is attached to this

pad using conductive die attach material. There is no

electrical or mechanical requirement to solder this pad.

However, if it is soldered, the solder land should remain

floating or be connected to GND.

Fig 4.

Pin configuration DIP20, SO20, (T)SSOP20

Fig 5.

Pin configuration DHVQFN20

74HC244

74HCT244

1OE

1A0

2OE

2Y0

1Y0

1A1

2A0

2Y1

1Y1

1A2

2A1

2Y2

1Y2

1A3

2A2

2Y3

1Y3

GND

2A3

001aae011

1

2

3

4

5

6

7

8

9

10

12

11

14

13

16

15

18

17

20

19

001aae012

74HC244

74HCT244

Transparent top view

1Y3

1A3

2Y3

2A2

2Y2

1Y2

1A2

2A1

2Y1

1Y1

1A1

2A0

2Y0

1Y0

1A0

2OE

9

12

8

13

7

14

6

15

5

16

4

17

3

18

2

19

terminal 1

index area

Table 2.

Pin description

Symbol

Pin

Description

1OE, 2OE

1, 19

output enable input (active LOW)

1A0, 1A1, 1A2, 1A3

2, 4, 6, 8

data input

2Y0, 2Y1, 2Y2, 2Y3

3, 5, 7, 9

bus output

GND

10

ground (0 V)

2A0, 2A1, 2A2, 2A3

17, 15, 13, 11

data input

1Y0, 1Y1, 1Y2, 1Y3

18, 16, 14, 12

bus output

20

supply voltage