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PACDN1404C ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 1 Page - California Micro Devices Corp

๋ถ€ํ’ˆ๋ช… PACDN1404C
์ƒ์„ธ๋‚ด์šฉ  ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE
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์ œ์กฐ์‚ฌ  CALMIRCO [California Micro Devices Corp]
ํ™ˆํŽ˜์ด์ง€  http://www.calmicro.com
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PACDN1404C ๋ฐ์ดํ„ฐ์‹œํŠธ(HTML) 1 Page - California Micro Devices Corp

   
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PACDN1404C
PACDN1408C
PACDN1416C
ยฉ 2000 California Micro Devices Corp. All rights reserved.
8/4/2000
1
CALIFORNIA MICRO DEVICES
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
ESD Protection Arrays, Chip Scale Package
Features
โ€ข 4, 8, or 16 transient voltage suppressors in a
single package
โ€ข In-system Electrostatic Discharge (ESD)
protection to 25kV contact discharge per
IEC 61000-4-2 international standard
โ€ข Compact Chip Scale Package (0.65mm pitch) format
saves board space and eases layout in space
critical applications compared to discrete
solutions and traditional wire bonded packages
Product Description
The PACDN1404C, PACDN1408C and PACDN1416C
are transient voltage suppressor arrays that provide a
very high level of protection for sensitive electronic
components that may be subjected to ESD.
These devices are designed and characterized to safely
dissipate ESD strikes at levels well beyond the maxi-
mum requirements set forth in the IEC 61000-4-2
international standard (Level 4, 8kV contact discharge).
All I/Os are rated at 25kV using the IEC 61000-4-2
contact discharge method. Using the MIL-STD-883D
Applications
โ€ข ESD protection of I/O port connections,
such as cellular phone, PDA, internet appliance
and PC ports
โ€ข Protection of interface ports or IC pins which are
exposed to high levels of ESD
C1230700
(Method 3015) specification for Human Body Model
(HBM) ESD, all pins are protected for contact discharges
to greater than 30kV.
The Chip Scale Package format of these devices enable
extremely small footprints that are necessary in portable
electronics such as cellular phones, PDAs, internet
appliances and PCs. The large solder bumps allow for
standard attachment to laminate boards without the use
of underfill.
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PACDN1404C
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