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SI7465DP-T1-GE3 데이터시트(PDF) 1 Page - Vishay Siliconix |
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SI7465DP-T1-GE3 데이터시트(HTML) 1 Page - Vishay Siliconix |
1 / 8 page Si7465DP www.vishay.com Vishay Siliconix S13-2263-Rev. D, 04-Nov-13 1 Document Number: 73113 For technical questions, contact: pmostechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 P-Channel 60 V (D-S) MOSFET FEATURES • TrenchFET® Power MOSFET • New Low Thermal Resistance PowerPAK® Package with Low 1.07 mm Profile • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 Notes a. Surface mounted on 1" x 1" FR4 board. b. See solder profile (www.vishay.com/ppg?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. c. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components. PRODUCT SUMMARY VDS (V) RDS(on) ()ID (A) Qg (TYP.) -60 0.064 at VGS = -10 V -5 26 0.080 at VGS = -4.5 V -4.5 1 2 3 4 5 6 7 8 S S S G D D D D 6.15 mm 5.15 mm PowerPAK SO-8 Bottom View Ordering Information: Si7465DP-T1-E3 (Lead (Pb)-free) Si7465DP-T1-GE3 (Lead (Pb)-free and Halogen-free) Available S G D P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER SYMBOL 10 s STEADY STATE UNIT Drain-Source Voltage VDS -60 V Gate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150°C)a TA = 25 °C ID -5 -3.2 A TA = 70 °C -4 -2.6 Pulsed Drain Current IDM -25 Continuous Source Current (Diode Conduction)a IS -2.9 -1.2 Avalanche Current L = 0.1 mH IAS 22 Single Pulse Avalanche Energy EAS 24.2 mJ Maximum Power Dissipationa TA = 25 °C PD 3.5 1.5 W TA = 70 °C 2.2 0.94 Operating Junction and Storage Temperature Range TJ, Tstg -55 to 150 °C Soldering Recommendations (Peak Temperature)b,c 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICAL MAXIMUM UNIT Maximum Junction-to-Ambienta t 10 s RthJA 27 36 °C/W Steady State 60 85 Maximum Junction-to-Case (Drain) Steady State RthJC 3.3 4.3 |
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