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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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BAR40AS3 데이터시트(PDF) 5 Page - Cystech Electonics Corp. |
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BAR40AS3 데이터시트(HTML) 5 Page - Cystech Electonics Corp. |
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5 / 6 page  CYStech Electronics Corp. Spec. No. : C302S346.13 Revised Date : 2012.02.10 Page No. : 5/7 BAR40S3/BAR40AS3/BAR40CS3/BAR40SS3 CYStek Product Specification Recommended wave soldering condition Soldering Time Product Peak Temperature Pb-free devices 5 +1/-1 seconds 260 +0/-5 °C Recommended temperature profile for IR reflow Pb-free Assembly Profile feature Sn-Pb eutectic Assembly Average ramp-up rate 3 °C/second max. 3 °C/second max. (Tsmax to Tp) Preheat 100 °C 150 °C −Temperature Min(TS min) −Temperature Max(TS max) 150 °C 200 °C −Time(ts min to ts max) 60-120 seconds 60-180 seconds Time maintained above: −Temperature (TL) 183 °C 217 °C − Time (tL) 60-150 seconds 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5 °C of actual peak 10-30 seconds 20-40 seconds temperature(tp) Ramp down rate 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Time 25 °C to peak temperature Note : All temperatures refer to topside of the package, measured on the package body surface. |
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유사한 설명 - BAR40AS3 |
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