Appendix

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ackage Drawing – TDFN6 2.5 mm x 2.5 mm

P

2.00 ± 0.05

C0.10

PIN 1 ID

0.30 ± 0.05(6x)

0.30 ± 0.05(6x)

0.65 TYP. (4x)

1.30 REF (2X)

1

3

1

3

6

4

4

PIN 1 INDEX AREA

2.50 ± 0.10

6

0.0-0.05

0.80 MAX

0.20 REF.

Note: Dimensions in mm. TDFN6 package has thermal power dissipation of 320°C/Watt in free air.

ackage Drawing – TDFN SO8

Attaching the package to a circuit board improves thermal performance.

P

5

4

5

1

5

8

1

PIN 1 INDEX AREA

4.900 ± 0.20

4

0.0-0.05

0.75±0.05

0.75±0.05 MAX

Pin 1 ID

3.90 ± 0.15

0.65 ± 0.10 (8x)

1.27 Typ. (6x)

3.81REF (2x)

0.40 ± 0.05 (8x)

Note: Dimensions in mm. TDFN SO8 Package has thermal power dissipation of 240°C/Watt in free air.

Attaching the package to a circuit board improves thermal performance.