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6N138 데이터시트(PDF) 2 Page - AVAGO TECHNOLOGIES LIMITED |
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6N138 데이터시트(HTML) 2 Page - AVAGO TECHNOLOGIES LIMITED |
2 / 14 page 2 Selection for lower input current down to 250 μA is available upon request. The HCPL-0701 and HCPL-0700 are surface mount devices packaged in an industry standard SOIC-8 footprint. The SOIC-8 does not require “through holes” in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. The HCNW139 and HCNW138 are packaged in a widebody encapsulation that provides creepage and clearance dimensions suitable for safety approval by regulatory agencies worldwide. Selection Guide Widebody 8-Pin DIP Package Hermetic (300 Mil) Small Outline SO-8 (400 mil) Single and Dual Single Dual Minimum Absolute Dual Single Channel Channel Channel Single Input ON Maxi- Channel Channel Package Package Package Channel Current Minimum mum Packages Package HCPL- HCPL- HCPL- Package (I F) CTR V CC HCPL- 6N139 2731[1] 0701 0731 HCNW139 0.5 mA 400% 18 V 6N138 2730[1] 0700 0730 HCNW138 1.6 mA 300% 7 V HCPL-4701[1] 4731[1] 070A[1] 073A[1] 40 μA 800% 18 V 0.5 mA 300% 20 V 5701[1] 5700[1] 5731[1] 5730[1] Note: 1. Technical data are on separate Avago publications. |
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