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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LM10506 데이터시트(PDF) 5 Page - Texas Instruments |
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LM10506 데이터시트(HTML) 5 Page - Texas Instruments |
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5 / 43 page  LM10506 www.ti.com SNVS729F – SEPTEMBER 2011 – REVISED AUGUST 2014 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT VIN, VCOMP −0.3 6 V VIN_IO, VIN_B1, VIN_B2, VIN_B3, SPI_CS, SPI_DI, SPI_CLK, SPI_DO, IRQ, HL_B2, HL_B3, −0.3 6 STANDBY, RESET, SW_B1, SW_B2, SW_B3, FB_B1, FB_B2, FB_B3, LDO Junction Temperature (TJ-MAX) 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Internal thermal shutdown protects device from permanent damage. Thermal shutdown engages at TJ = 140°C and disengages at TJ = 120°C (typ.). Thermal shutdown is ensured by design. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2000 2000 V(ESD) Electrostatic discharge V pins(1) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN_B1, VIN_B2_VIN_B3, VIN 3 5.5 VIN_IO (< VIN) 1.72 3.63 (but < VIN) V All pins except VIN_IO 0 VIN Junction temperature (TJ) −40 125 °C Ambient temperature (TA) −40 85 Maximum continuous power dissipation (PD-MAX) (1) 0.9 W (1) In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 7.4 Thermal Information LM10506 THERMAL METRIC(1) DSBGA UNIT 34 PINS RθJA Junction-to-ambient thermal resistance 44.5 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM10506 |
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