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LM3429 데이터시트(PDF) 6 Page - Texas Instruments

부품명 LM3429
상세설명  LM3429Q1 N-Channel Controller for Constant Current LED Drivers
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홈페이지  http://www.ti.com
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LM3429 데이터시트(HTML) 6 Page - Texas Instruments

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LM3429
SNVS616F – APRIL 2009 – REVISED JANUARY 2010
www.ti.com
Electrical Characteristics
(1) (continued)
Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating
Temperature Range ( TJ = −40°C to +125°C). Minimum and Maximum limits are guaranteed through test, design, or
statistical correlation. Typical values represent the most likely parametric norm at TJ = +25°C, and are provided for reference
purposes only. Unless otherwise stated the following condition applies: VIN = +14V.
Min
Typ
Max
Symbol
Parameter
Conditions
Units
(2)
(3)
(2)
Transconductance
ICSH = 100 µA
250
500
kHz
Bandwidth
(4)
GATE DRIVER (GATE)
RSRC(GATE)
GATE Sourcing Resistance GATE = High
2.0
6.0
RSNK(GATE)
GATE Sinking Resistance
GATE = Low
1.3
4.5
UNDER-VOLTAGE LOCKOUT and DIM INPUT (nDIM)
VTH-nDIM
nDIM / UVLO Threshold
1.180
1.240
1.280
V
IHYS-nDIM
nDIM Hysteresis Current
10
20
30
µA
THERMAL SHUTDOWN
TSD
Thermal Shutdown
(4)
165
Threshold
°C
THYS
Thermal Shutdown
(4)
25
Hysteresis
THERMAL RESISTANCE
θJA
Junction to Ambient
14L TSSOP EP
40
°C/W
(5)
θJC
Junction to Exposed Pad
14L TSSOP EP
5.5
°C/W
(DAP)
(5)
Junction-to-ambient thermal resistance is highly board-layout dependent. The numbers listed in the table are given for a reference layout
wherein the 14L TSSOP EP package has its DAP pad populated with 9 vias. In applications where high maximum power dissipation
exists, namely driving a large MosFET at high switching frequency from a high input voltage, special care must be paid to thermal
dissipation issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the
maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the package in
the application (
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). In most applications there is little need for
the full power dissipation capability of this advanced package. Under these circumstances, no vias would be required and the thermal
resistances would be 104 °C/W for the 14L TSSOP EP. It is possible to conservatively interpolate between the full via count thermal
resistance and the no via count thermal resistance with a straight line to get a thermal resistance for any number of vias in between
these two limits.
6
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