CD4066B-Q1

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SCHS383

– APRIL 2011

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

–0.5 to 20

V

V

DC input current, IIN (any one input)

±10

mA

Package thermal impedance,

(2)

D package

86

°C/W

Human-Body Model (HBM)

500

Machine Model (MM)

150

V

Field_Induced_Charged Device Model (CDM)

1000

Lead temperature (during soldering): At distance 1/16

± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max

265

°C

–65 to 150

°C

(1)

Stresses beyond those listed under

"absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under

"recommended operating

conditions

" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

(3)

Tested in accordance with AEC-Q100.

THERMAL INFORMATION

CD4066B-Q1

D PACKAGE

UNITS

14 PINS

Junction-to-ambient thermal resistance

92.4

Junction-to-case (top) thermal resistance

52.5

Junction-to-board thermal resistance

46.7

°C/W

Junction-to-top characterization parameter

46.4

Junction-to-board characterization parameter

46.4

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Supply voltage

3

18

V

Operating free-air temperature

–40

125

°C

Copyright

© 2011, Texas Instruments Incorporated

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