전자부품 데이터시트 검색엔진 |
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HCPL-0872-000E 데이터시트(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-0872-000E 데이터시트(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED |
5 / 12 page 5 Electrical Specifications (DC) Unless otherwise noted, all Typical specifications are at TA = 25°C and VDD = 5 V, and all Minimum and Maximum specifications apply over the following ranges: TA = -40°C to +85°C and VDD = 4.5 to 5.5 V. Absolute Maximum Ratings Notes: 1. Avago Technologies recommends the use of non-chlorinated solder fluxes. Notes 1. Avago Technologies recommends the use of non-chlorinated solder fluxes. Parameter Symbol Min. Max. Units Ambient Operating Temperature TA -40 85 °C Supply Voltage VDD 4.5 5.5 V Input Voltage All Inputs 0 VDD V Parameter Symbol Min. Typ. Max. Units Test Conditions Fig. Supply Current IDD 3 5 mA fCLK = 10 MHz DC Input Current IIN 0.001 10 µA Input Logic Low Voltage VIL 0.8 V Input Logic High Voltage VIH 3.6 V Output Logic Low Voltage VOL 0.15 0.4 V IOUT = 4 mA Output Logic High Voltage VOH 4.3 5.0 V IOUT = -400 µA Clock Frequency (CCLK, MCLK and SCLK) fCLK 20 MHz Clock Period (CCLK, MCLK and SCLK) tPER 50 ns 2, 3 Clock High Level Pulse Width (CCLK, MCLK and SCLK) tPWH 20 ns 2, 3 Clock Low Level Pulse Width (CCLK, MCLK and SCLK) tPWL 20 ns 2, 3 Setup Time from DAT to Rising Edge of CLK (CDAT, CCLK, MDAT and MCLK) tSUCLK 10 ns 2 DAT Hold Time after Rising Edge of CLK (CDAT, CCLK, MDAT and MCLK) tHDCLK 10 ns 2 Setup Time from Falling Edge of CLAT to First Rising Edge of CCLK tSUCL1 20 ns 2 Setup Time from Last Rising Edge of CCLK to Rising Edge of CLAT tSUCL2 20 ns 2 Delay Time from Falling Edge of SCLK to SDAT tDSDAT 15 ns 3 Setup Time from Data Ready to First Falling Edge of SCLK tSUS 200 ns 3 Setup Time from CHAN to falling edge of CS tSUCHS 20 ns Reset High Level Pulse Width tPWR 100 ns Parameter Symbol Min. Max. Units Note Storage Temperature TS -55 125 °C Operating Temperature TA -40 85 °C Supply Voltage VDD 0 5.5 V Input Voltage All Inputs -0.5 VDD + 0.5 V Output Voltage All Outputs -0.5 VDD + 0.5 V Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane 1 Solder Reflow Temperature Profile See Reflow Thermal Profile Recommended Operating Conditions |
유사한 부품 번호 - HCPL-0872-000E |
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유사한 설명 - HCPL-0872-000E |
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