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SB3H150 데이터시트(PDF) 2 Page - Diotec Semiconductor |
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SB3H150 데이터시트(HTML) 2 Page - Diotec Semiconductor |
2 / 2 page SB3H150 Characteristics Kennwerte Leakage current Sperrstrom Tj = 25°C Tj = 125°C VR = VRRM VR = VRRM IR IR < 2µA < 2mA Thermal resistance junction to ambient air Wärmewiderstand Sperrschicht – umgebende Luft RthA < 25 K/W 1) Thermal resistance junction to leads Wärmewiderstand Sperrschicht – Anschlussdraht RthL < 8 K/W 1 Valid, if leads are kept at ambient temperature at a distance of 10 mm from case Gültig, wenn die Anschlussdrähte in 10 mm Abstand vom Gehäuse auf Umgebungstemperatur gehalten werden 2 http://www.diotec.com/ © Diotec Semiconductor AG 120 100 80 60 40 20 0 [%] I FAV Rated forward current versus ambient temperature ) Zul. Richtstrom in Abh. von der Umgebungstemp. ) 1 1 [°C] T A 150 100 50 0 [A] I F Forward characteristics (typical values) Durchlasskennlinien (typische Werte) 10 10 1 10 10 2 -1 -2 0 V F 0.4 0.6 [V] 1.0 T = 25°C j T = 125°C j 10 10 10 1 3 2 10-1 [µA] I R 0 V RRM 40 60 100 [%] Typ. instantaneous leakage current vs. rev. voltage Typ. Sperrstrom (Augenblickswert) ü. Sperrspannung T = 25°C j T = 125°C j T = 100°C j T = 50°C j |
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