전자부품 데이터시트 검색엔진 |
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HCPL-6530 데이터시트(PDF) 2 Page - Agilent(Hewlett-Packard) |
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HCPL-6530 데이터시트(HTML) 2 Page - Agilent(Hewlett-Packard) |
2 / 12 page 1-560 capability will enable the designer to interface any TTL family to CMOS. The availability of the base lead allows optimized gain/ bandwidth adjustment in analog applications. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor couplers. These products are also available with the transistor base node connected to improve common mode noise immunity and ESD susceptibility. In addition, higher CTR minimums are available by special request. Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respec- tively), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Military Drawing (SMD) parts are available for each package and lead style. Because the same functional die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results. Selection Guide–Package Styles and Lead Configuration Options Package 16 Pin DIP 8 Pin DIP 8 Pin DIP 16 Pin Flat Pack 20 Pad LCCC Lead Style Through Hole Through Hole Through Hole Unformed Leads Surface Mount Channels 2 1 2 4 2 Common Channel Wiring None None VCC GND VCC GND None HP Part # & Options Commercial 4N55* HCPL-5500 HCPL-5530 HCPL-6550 HCPL-6530 MIL-PRF-38534, Class H 4N55/883B HCPL-5501 HCPL-5531 HCPL-6551 HCPL-6531 MIL-PRF-38534, Class K HCPL-257K HCPL-550K HCPL-553K HCPL-655K HCPL-653K Standard Lead Finish Gold Plate Gold Plate Gold Plate Gold Plate Solder Pads Solder Dipped Option #200 Option #200 Option #200 Butt Cut/Gold Plate Option #100 Option #100 Option #100 Gull Wing/Soldered Option #300 Option #300 Option #300 SMD Part # Prescript for all below 5962- 5962- 5962- 5962- 5962- Either Gold or Solder 8767901EX 9085401HPX 8767902PX 8767904FX 87679032X Gold Plate 8767901EC 9085401HPC 8767902PC 8767904FC Solder Dipped 8767901EA 9085401HPA 8767902PA 87679032A Butt Cut/Gold Plate 8767901UC 9085401HYC 8767902YC Butt Cut/Soldered 8767901UA 9085401HYA 8767902YA Gull Wing/Soldered 8767901TA 9085401HXA 8767902XA *JEDEC registered part. 8 Pin Ceramic DIP Single Channel Schematic ANODE 3 CATHODE 6 5 VO GND IO IF 2 + – VF 8 VCC 7 VB IB ICC Note base pin 7. |
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