전자부품 데이터시트 검색엔진 |
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GT28F016C3B90 데이터시트(PDF) 8 Page - Intel Corporation |
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GT28F016C3B90 데이터시트(HTML) 8 Page - Intel Corporation |
8 / 59 page 3 VOLT ADVANCED+ BOOT BLOCK E 8 PRODUCT PREVIEW A13 A11 A8 VPP WP# A7 A4 A B C D E F 123 456 7 8 A14 A10 WE# RP# A18 A17 A5 A2 A15 A12 A9 A6 A3 A1 A16 D14 D5 D11 D2 D8 CE# A0 VCCQ D15 D6 D12 D3 D9 D0 GND GND D7 D13 D4 VCC D10 D1 OE# A19 16M A20 32M NOTES: 1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address solder balls. Routing is not recommended in this area. A19 is the upgrade address for the 16-Mbit device. A20 is the upgrade address for the 32-Mbit device. 2. 8-Mbit not available on µBGA* CSP. Figure 3. x16 48-Ball µBGA* Chip Size Package (Top View, Ball Down) A14 A12 A8 VPP WP# A7 A4 A B C D E F 1 234 56 7 8 A15 A10 WE# RP# A19 A18 A5 A2 A16 A13 A9 A6 A3 A1 A17 NC D5 NC D2 NC CE# A0 VCCQ A11 D6 NC D3 NC D0 GND GND D7 NC D4 VCC NC D1 OE# A20 A21 32M 16M NOTES: 1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the upper address solder balls. Routing is not recommended in this area. A20 is the upgrade address for the 16-Mbit device. A21 is the upgrade address for the 32-Mbit device. 2. 8-Mbit not available on µBGA* CSP. Figure 4. x8 48-Ball µBGA* Chip Size Package (Top View, Ball Down) |
유사한 부품 번호 - GT28F016C3B90 |
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유사한 설명 - GT28F016C3B90 |
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