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SSOT-24 데이터시트(PDF) 3 Page - Torex Semiconductor |
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SSOT-24 데이터시트(HTML) 3 Page - Torex Semiconductor |
3 / 4 page ●SSOT-24 Power Dissipation Power dissipation data for the SSOT-24 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as the reference data taken in the following condition. Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient Temperature (85℃) Board Mount (Tjmax=125℃) 3. Power Dissipation vs. Ambient Temperature (105℃) Board Mount (Tjmax=125℃) Ambient Temperature (℃) Power Dissipation Pd (mW) Thermal Resistance (℃/W) 25 500 200.00 85 200 Ambient Temperature (℃) Power Dissipation Pd (mW) Thermal Resistance (℃/W) 25 500 200.00 85 100 Evaluation Board (Unit: mm) Pd vs. Ta Ambient Temperature Ta(℃) Pd vs. Ta Ambient Temperature Ta(℃) |
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유사한 설명 - SSOT-24 |
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