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L6207 데이터시트(PDF) 11 Page - STMicroelectronics

부품명 L6207
상세설명  APPLICATION NOTE
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AN1762 APPLICATION NOTE
Resistor
R4 is added to reduce the maximum current in the external components and to reduce the slew rate of
the rising and falling edges of the voltage at the
CP pin, in order to minimize interferences with the rest of the
circuit. For the same reason care must be taken in realizing the PCB layout of
R4, C5, D1, D2 connections (see
also the
Layout Considerations section). Recommended values for the charge pump circuitry are:
D1, D2
: 1N4148
R4
: 100
Ω (1/8 W)
C5
: 10nF 100V ceramic
C8
: 220nF 25V ceramic
Due to the high charge pump frequency, fast diodes are required. Connecting the cold side of the bulk capacitor
(C8) to VS instead of GND the average current in the external diodes during operation is less than 10 mA (with
R4 = 100
Ω); at startup (when VS is provided to the IC) is less than 200 mA while the reverse voltage is about
10 V in all conditions. 1N4148 diodes withstand about 200 mA DC (1 A peak), and the maximum reverse voltage
is 75 V, so they should fit for the majority of applications.
3.7 Sharing the Charge Pump Circuitry
If more than one device is used in the application, it's possible to use the charge pump from one L6205, L6206
or L6207 to supply the VBOOT pins of several ICs. The unused CP pins on the slaved devices are left uncon-
nected, as shown in Figure 10. A 100nF capacitor (C8) should be connected to the VBOOT pin of each device.
Supply voltage pins (VS) of the devices sharing the charge pump must be connected together.
The higher the number of devices sharing the same charge pump, the lower will be the differential voltage avail-
able for gate drive (VBOOT - VS), causing a higher RDS(ON) for the high side DMOS, so higher dissipating power.
In this case it's recommended to omit the resistor on the
CP pin, obtaining a higher current capability of the
charge pump circuitry.
Better performance can also be obtained using a 33nF capacitor for C5 and using schottky diodes (for example
BAT47 are recommended).
Sharing the same charge pump circuitry for more than 3÷4 devices is not recommended, since it will reduce the
VBOOT voltage increasing the high-side MOS on-resistance and thus power dissipation.
Figure 10. Sharing the charge pump circuitry.
VSA
VSB
VBOOT
CP
C18 = 100 nF
To High-Side
Gate Drivers
VSA
VSB
VBOOT
C8 = 100nF
To High-Side
Gate Drivers
To other Devices
CP
L6205, L6206, L6207
L6205, L6206, L6207
D1 = BAT47
D2 = BAT47
C5 = 33nF


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