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IRFP7530PBF 데이터시트(PDF) 2 Page - International Rectifier

부품명 IRFP7530PBF
상세설명  Brushed Motor drive applications
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제조업체  IRF [International Rectifier]
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IRFP7530PBF 데이터시트(HTML) 2 Page - International Rectifier

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November 7, 2014
 
IRFP7530PbF
Absolute Maximum Rating
Symbol
Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
281
A
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
199
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)
195
IDM
Pulsed Drain Current 
760
PD @TC = 25°C
Maximum Power Dissipation
341
W
Linear Derating Factor
2.3
W/°C
VGS
Gate-to-Source Voltage
± 20
V
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175  
°C  
Soldering Temperature, for 10 seconds (1.6mm from case)
300
Mounting Torque, 6-32 or M3 Screw
10 lbf·in (1.1 N·m)
 
Avalanche Characteristics 
EAS (Thermally limited)
Single Pulse Avalanche Energy 
557
mJ
EAS (Thermally limited)
Single Pulse Avalanche Energy 
1102
IAR
Avalanche Current 
See Fig 15, 16, 23a, 23b
A
EAR
Repetitive Avalanche Energy 
mJ
Thermal Resistance  
Symbol
Parameter
Typ.
Max.
Units
RJC
Junction-to-Case 
–––
0.44
°C/W  
RCS
Case-to-Sink, Flat Greased Surface
0.24
–––
RJA
Junction-to-Ambient 
–––
40
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
60
–––
–––
V
VGS = 0V, ID = 250µA
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient
–––
47
–––
mV/°C Reference to 25°C, ID = 1mA 
RDS(on)
Static Drain-to-Source On-Resistance
–––
1.65 2.00
VGS = 10V, ID = 100A 
–––
2.10
–––
VGS = 6.0V, ID = 50A 
VGS(th)
Gate Threshold Voltage
2.1
–––
3.7
V
VDS = VGS, ID = 250µA
IDSS
Drain-to-Source Leakage Current
–––
–––
1.0
µA
VDS =60 V, VGS = 0V
–––
–––
150
VDS =60V,VGS = 0V,TJ =125°C
IGSS
Gate-to-Source Forward Leakage
–––
–––
100
nA
VGS = 20V
Gate-to-Source Reverse Leakage
–––
–––
-100
VGS = -20V
RG
Gate Resistance
–––
2.1
–––

m

Notes:

Calculated continuous current based on maximum allowable junction temperature. Bond wire current limit is 195A by
source bonding technology. Note that current limitations arising from heating of the device leads may occur with
some lead mounting arrangements. (Refer to AN-1140)

Repetitive rating; pulse width limited by max. junction temperature.
Limited by TJmax, starting TJ = 25°C, L = 111µH, RG = 50, IAS = 100A, VGS =10V.

ISD  100A, di/dt  1338A/µs, VDD  V(BR)DSS, TJ 175°C.

Pulse width
 400µs; duty cycle  2%.
Coss eff. (TR) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.
Coss eff. (ER) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 to 80% VDSS.
Ris measured at TJ approximately 90°C.
Limited by TJmax, starting TJ = 25°C, L = 1mH, RG = 50, IAS = 47A, VGS =10V.


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