ISL267817

2

FN7877.2

April 19, 2012

Typical Connection Diagram

Pin Configuration

ISL267817

(8 LD SOIC, MSOP)

TOP VIEW

VREF

+IN

–IN

GND

+VCC

DCLOCK

DOUT

CS/SHDN

+

+

+5V SUPPLY

µP/µC

VREF

SERIAL

INTERFACE

10µF

0.1µF

VREF

8

7

6

5

1

2

3

4

+IN

–IN

GND

+VCC

DCLOCK

DOUT

CS/SHDN

Pin Descriptions

PIN NAME

PIN NUMBER

DESCRIPTION

VREF

1

Reference Input

+IN

2

Non Inverting Input

–IN

3

Inverting Input

GND

4

Ground

CS/SHDN

5

Low = Chip Select, High = Shutdown

DOUT

6

Serial Output Data

DCLOCK

7

Data Clock

+VCC

8

Power Supply

Ordering Information

PART NUMBER

(Notes 1, 2, 3)

PART

MARKING

+VCC RANGE

(V)

TEMP RANGE

(°C)

PACKAGE

PKG.

DWG. #

ISL267817IBZ

267817 IBZ

4.75 to 5.25

-40°C to +85°C

8 Ld SOIC

M8.15

ISL267817IUZ

67817

4.75 to 5.25

-40°C to +85°C

8 Ld MSOP

M8.118

NOTES:

1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for the ISL267817. For more information on MSL please see tech brief

TB363.