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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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TLE9260QX 데이터시트(PDF) 10 Page - Infineon Technologies AG |
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TLE9260QX 데이터시트(HTML) 10 Page - Infineon Technologies AG |
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10 / 141 page  TLE9260QX Pin Configuration Data Sheet 10 Rev. 1.1, 2014-09-26 Note: all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required; all GND pins as well as the Cooling Tab must be connected to one common GND potential; 31 INT Interrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal Mode and for indicating failures. Active low. During start-up used to set the SBC configuration. External pull-up sets config 1/3, no external pull-up sets config 2/4. 32 RO Reset Output 33 N.U. Not Used; Used for internal testing purpose. Do not connect, leave open 34 N.U. Not Used; Used for internal testing purpose. Do not connect, leave open 35 TXDCAN Transmit CAN 36 RXDCAN Receive CAN 37 VCAN Supply Input; for internal HS-CAN cell 38 GND GND 39 CANL CAN Low Bus Pin 40 CANH CAN High Bus Pin 41 n.c. not connected; internally not bonded. 42 N.U. Not Used; Used for internal testing purpose. Do not connect, leave open 43 GND Ground 44 N.U. Not Used; Used for internal testing purpose. Do not connect, leave open 45 n.c. not connected; internally not bonded. 46 n.c. not connected; internally not bonded. 47 FO2 Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output; Open drain. Active LOW. Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by VSHS (default is FO2, see also Chapter 12.1.1) 48 FO3/TEST Fail Output 3 - Pulsed Light Output; Break/rear light 100Hz 20% duty cycle output; Open drain. Active LOW TEST; Connect to GND to activate SBC Software Development Mode; Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for normal operation. Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by VSHS (default is FO3, see also Chapter 12.1.1) Cooling Tab GND Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an electrical ground.1) 1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB. The exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND (recommended) for the best EMC performance. Pin Symbol Function |
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