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SI7272DP 데이터시트(PDF) 9 Page - Vishay Telefunken |
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9 / 13 page PowerPAK® SO-8 Mounting and Thermal Considerations Application Note AN821 www.vishay.com Vishay Siliconix Revision: 16-Mai-13 2 Document Number: 71622 For technical questions, contact: powermosfettechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PowerPAK SO-8 DUAL The pin arrangement (drain, source, gate pins) and the pin dimensions of the PowerPAK SO-8 dual are the same as standard SO-8 dual devices. Therefore, the PowerPAK device connection pads match directly to those of the SO-8. As in the single-channel package, the only exception is the extended drain connection area. Manufacturers can likewise take immediate advantage of the PowerPAK SO-8 dual devices by mounting them to existing SO-8 dual land patterns. To take the advantage of the dual PowerPAK SO-8’s thermal performance, the minimum recommended land pattern can be found in Application Note 826, Recommended Minimum Pad Patterns With Outline Drawing Access for Vishay Siliconix MOSFETs. Click on the PowerPAK 1212-8 dual in the index of this document. The gap between the two drain pads is 24 mils. This matches the spacing of the two drain pads on the PowerPAK SO-8 dual package. REFLOW SOLDERING Vishay Siliconix surface-mount packages meet solder reflow reliability requirements. Devices are subjected to solder reflow as a test preconditioning and are then reliability-tested using temperature cycle, bias humidity, HAST, or pressure pot. The solder reflow temperature profile used, and the temperatures and time duration, are shown in figures 3 and 4. For the lead (Pb)-free solder profile, see www.vishay.com/doc?73257. Fig. 3 Solder Reflow Temperature Profile Fig. 4 Solder Reflow Temperatures and Time Durations Ramp-Up Rate + 3 °C /s max. Temperature at 150 - 200 °C 120 s max. Temperature Above 217 °C 60 - 150 s Maximum Temperature 255 + 5/- 0 °C Time at Maximum Temperature 30 s Ramp-Down Rate + 6 °C/s max. 260 °C 3 °C(max) 6 °C/s (max.) 30 s 217 °C 150 s (max.) Reflow Zone 60 s (min.) Pre-Heating Zone 150 - 200 °C Maximum peak temperature at 240 °C is allowed. |
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