LC898122XA

www.onsemi.com

4

Package Dimensions

unit : mm

WLCSP30, 2.59x1.99

CASE 567HG

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

MILLIMETERS

A1

D

2.59 BSC

E

b

0.15

0.25

e

0.40 BSC

0.45

E

D

A

B

PIN A1

REFERENCE

e

A

0.05

B

C

0.03 C

0.05 C

30X

b

45

C

B

A

0.10 C

A1

A

C

0.03

0.13

1.99 BSC

0.20

30X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.40

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

e

RECOMMENDED

PACKAGE

OUTLINE

12

3

PITCH

D

E

PITCH

A1

30X

DIE COAT

F

e/2