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LM339PW 데이터시트(PDF) 5 Page - Texas Instruments |
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LM339PW 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 37 page LM139, LM239, LM339, LM139A LM239A, LM339A, LM2901, LM2901AV, LM2901V www.ti.com SLCS006T – OCTOBER 1979 – REVISED JUNE 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) 36 V VID Differential input voltage(3) ±36 V VI Input voltage range (either input) –0.3 36 V VO Output voltage 36 V IO Output current 20 mA Duration of output short circuit to ground(4) Unlimited TJ Operating virtual-junction temperature 150 °C Case temperature for 60 s FK package 260 °C Lead temperature 1.6 mm (1/16 in) from case for 60 s J package 300 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground. (3) Differential voltages are at xIN+ with respect to xIN–. (4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±750 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Non-V devices 2 30 V VCC Supply voltage V devices 2 32 V TJ Junction temperature –40 125 °C 7.4 Thermal Information (14-Pin Packages) LMx39, LM2901 THERMAL METRIC(1) UNIT D DB N NS PW J W (SOIC) (SSOP) (PDIP) (SO) (TSSOP) (CDIP) (CFP) RθJA Junction-to-ambient thermal resistance 86 96 80 76 113 °C/W RθJC(top) Junction-to-case (top) thermal resistance 15.05 14.65 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.5 Thermal Information (20-Pin Packages) LMx39, LM2901 THERMAL METRIC(1) UNIT FK (LCCC) RθJC(top) Junction-to-case (top) thermal resistance 5.61 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 1979–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM139 LM239 LM339 LM139A LM239A LM339A LM2901 LM2901AV LM2901V |
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