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TPA3251D2 데이터시트(PDF) 5 Page - Texas Instruments |
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TPA3251D2 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 39 page TPA3251D2 www.ti.com SLASE40C – JUNE 2015 – REVISED JUNE 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT BST_X to GVDD_X(2) –0.3 50 V VDD to GND –0.3 13.2 V GVDD_X to GND(2) –0.3 13.2 V Supply voltage PVDD_X to GND(2) –0.3 50 V DVDD to GND –0.3 4.2 V AVDD to GND –0.3 8.5 V VBG to GND -0.3 4.2 V OUT_X to GND(2) –0.3 50 V BST_X to GND(2) –0.3 62.5 V OC_ADJ, M1, M2, OSC_IOP, OSC_IOM, FREQ_ADJ, C_START, to GND –0.3 4.2 V Interface pins RESET, FAULT, CLIP_OTW, CLIP to GND –0.3 4.2 V INPUT_X to GND –0.3 7 V Continuous sink current, RESET, FAULT, CLIP_OTW, CLIP, RESET to 9 mA GND TJ Operating junction temperature range 0 150 °C Tstg Storage temperature range –40 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) These voltages represents the DC voltage + peak AC waveform measured at the terminal of the device in all conditions. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all ±2000 V pins (1) VESD Electrostatic discharge Charged device model (CDM), per JEDEC specification ±500 V JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPA3251D2 |
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