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CDCL1810RGZRG4 데이터시트(PDF) 4 Page - Texas Instruments |
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CDCL1810RGZRG4 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 33 page NC AV DD CLKP CLKN AV DD YP0 YN0 V DD YP1 YN1 V DD V SS ADD0 V DD YN7 YP7 V DD YN6 YP6 V DD YN5 YP5 V DD SDA 1 2 3 4 5 6 7 8 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 CDCL1810 NOTE:Exposedthermalpadmustbesolderedto V SS. CDCL1810 SLLS781D – FEBRUARY 2007 – REVISED NOVEMBER 2014 www.ti.com 7 Pin Configuration and Functions 48-PIN VQFN Package RGZ (Top View) The CDCL1810 is available in a 48-pin VQFN (RGZ) package with a pin pitch of 0.5 mm. The exposed thermal pad serves both thermal and electrical grounding purposes. The device must be soldered to ground (VSS) using as many ground vias as possible. The device performance will be severely impacted if the exposed thermal pad is not grounded appropriately. 4 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated Product Folder Links: CDCL1810 |
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