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TS33001-M012QFNR 데이터시트(PDF) 10 Page - Semtech Corporation

부품명 TS33001-M012QFNR
상세설명  High Efficiency Synchronous 1/2/3A DC/DC Buck Converter, 5Mhz
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제조업체  SEMTECH [Semtech Corporation]
홈페이지  http://www.semtech.com
Logo SEMTECH - Semtech Corporation

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TS33001/2/3
Final Datasheet
Rev 1.6
January 15, 2016
www.semtech.com
10 of 16
Semtech
Proprietary & Confidential
External Component Selection
The internal compensation is optimized for a 10uF output capacitor and a 1uH inductor. To keep the output ripple low, a low
ESR (less than 20mOhm) ceramic is recommended. For optimal over-current protection, inductor should be able to handle the
3.7A for the 3A version, 2.7A for the 2A version and 1.7A for the 1A version without saturation.
Application Using A Multi-Layer PCB
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed
when laying out this part on the PCB.
The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Via's
Package Outline
Package and PCB Land Configuration
For a Multi-Layer PCB
JEDEC standard FR4 PCB Cross-section:
(square)
Package Solder Pad
Component Traces
4 Plane
2 Plane
1.5748mm
Thermal Via
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
1.0142 - 1.0502 mm
Ground Plane (1oz
Cu)
Thermal Isolation
Power plane only
Package Solder Pad
(bottom trace)
0.5246 - 0.5606 mm
Power Plane (1oz
Cu)
0.0 - 0.071 mm Board Base
& Bottom Pad
Multi-Layer Board (Cross-sectional View)
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to
the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias,
thickness of copper, etc.


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