전자부품 데이터시트 검색엔진 |
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TDA21201 데이터시트(PDF) 8 Page - Infineon Technologies AG |
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TDA21201 데이터시트(HTML) 8 Page - Infineon Technologies AG |
8 / 15 page Preliminary Data Sheet TDA21201 Page 8 Apr-29, 2002 frequencies will also result in more losses. So, in modifying the thermal environment and a switching frequency the phase current can be matched your requirements; please, consult the efficiency curves in this Data Sheet to choose the most suitable phase current and switching frequency per phase for a particular design. To give a circuit designer more freedom in scaling the phase current, the Integrated Switch is offered in a heat sink capable TO-220 version that allows better thermal coupling to ambient and a higher junction temperature in the Integrated Switch as well - without violating the applicable regulations. Over temperature shut-down The over temperature shut-down function of the Integrated Switch takes effect @ 150 °C junction temperature typically and turns off the High side MOSFET and the Low side MOSFET. Unlike as in discrete converter solutions the MOSFETs and the Driver are thermally very well coupled. Therefore, this function protects the Driver and the MOSFETs. Once the Integrated Switch is cooled down and the temperature shut-down is released the Integrated Switch continues to operate by turning on one of the MOSFETs according to its PWM signal present on the input. Under Voltage Lockout / ∆ Vcc detection The TDA21201 is fully functional at Vcc ≥ 9 V. However, the Low side MOSFET can already be turned on at Vcc ≈ 6 V or greater when the input is Low. The Integrated Switch is disabled and both MOSFETs are turned off at lower Vcc, e.g. during power-up of the ATX supply. The TDA21201 has two paralleled Vcc pins. The voltage applied to these pins will be converted to a lower output voltage but it also serves as supply voltage of the integrated gate drive circuit. Therefore, the voltage difference ∆ Vcc is monitored for safety reasons. When ∆ Vcc ≥ 0.45 V for more than 2 µs typically the Integrated Switch is disabled. This way it prevents the part itself but it also protects the load from inadequate behavior, e.g. due to a bad soldering connection of the Vcc pins. Layout guidelines In general, the layout is simplified when using the Integrated Switch. However, it should be kept in mind that the power density in the Integrated Switch is higher than in a discrete solution. Therefore, proper thermal layout is very critical in designs that employ the SMD version. Another important aspect is a very low impedance path in the Vcc = 12 V à TDA21201 à GND loop. It is recommended to place the capacitors of the input filter as close to the GND and Vcc pins of the TDA21201 as possible. Additional ceramic capacitors in parallel to the input capacitors help to reduce the effect of stray inductance of the input capacitors and the PCB traces. Reducing parasitic inductance will result in an optimized switching behavior and lower switching losses. The arrangement of the output filter is of second order importance. |
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