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LM27951 데이터시트(PDF) 4 Page - Texas Instruments |
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LM27951 데이터시트(HTML) 4 Page - Texas Instruments |
4 / 20 page 4 LM27951 SNVS416C – NOVEMBER 2005 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: LM27951 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office / Distributors for availability and specifications. (3) Maximum value is 6 V. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN –0.3 6 V EN, PWM –0.3 VIN + 0.3 (3) V Continuous power dissipation Internally limited Junction temperature, TJ-MAX-ABS 150 °C Lead temperature (Soldering, 5 sec.) 260 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) All voltages are with respect to the potential at the GND pin. (2) Minimum and maximum limits are ensured by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely norm. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operation junction temperature (TJ-MAX-OP = 115°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN NOM MAX UNIT Inpu voltage, VIN 2.8 5.5 V LED voltage 2.5 3.9 V Junction temperature, TJ –40 115 °C Ambient temperature, TA –40 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LM27951 UNIT NHK (WSON) 14 PINS RθJA Junction-to-ambient thermal resistance 42.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 33.3 °C/W RθJB Junction-to-board thermal resistance 14.1 °C/W ψJT Junction-to-top characterization parameter 0.5 °C/W ψJB Junction-to-board characterization parameter 14.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 6.1 °C/W |
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유사한 설명 - LM27951_16 |
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