AD6673BCPZ-250 datasheet(11/45 Pages) AD

부품명	AD6673BCPZ-250

상세설명	80 MHz Bandwidth, Dual IF Receiver

Download	45 Pages

Scroll/Zoom	100%

제조업체	AD [Analog Devices]

홈페이지	http://www.analog.com

Logo

11 / 45 page

Data Sheet

AD6673

Rev. C | Page 11 of 45

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

ELECTRICAL

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

DVDD to DGND

−0.3 V to +2.0 V

VIN+A/VIN+B, VIN−A/VIN−B to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

RFCLK to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

CS, PDWN to AGND

−0.3 V to AVDD + 0.3 V

SCLK to AGND

−0.3 V to AVDD + 0.3 V

SDIO to AGND

−0.3 V to AVDD + 0.3 V

RST to DGND

−0.3 V to DVDD + 0.3 V

FDA, FDB to DGND

−0.3 V to DVDD + 0.3 V

SERDOUT0+, SERDOUT0−,

SERDOUT1+, SERDOUT1− to AGND

−0.3 V to DRVDD + 0.3 V

SYNCINB+, SYNCINB− to DGND

−0.3 V to DVDD + 0.3 V

SYSREF+, SYSREF− to AGND

−0.3 V to AVDD + 0.3 V

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +125°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. This increases the reliability of the solder

joints, maximizing the thermal capability of the package.

Table 7. Thermal Resistance

PackageType

Airflow

Velocity

(m/sec)

θ

JA

1,2

θ

JC

1,3

θ

JB

1,4

Unit

48-Lead LFCSP

7 mm × 7 mm

(CP-48-13)

0

25

2

14

°C/W

1.0

22

°C/W

2.5

20

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-STD-883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Typical θJA is specified for a 4-layer printed circuit board (PCB)

with a solid ground plane. As shown in Table 7, airflow increases

heat dissipation, which reduces θJA. In addition, metal in direct

contact with the package leads from metal traces, through holes,

ground, and power planes reduces the θJA.

ESD CAUTION

유사한 부품 번호 - AD6673BCPZ-250

제조업체	부품명	데이터시트	상세설명
Analog Devices	AD6673BCPZ-250	1Mb / 46P	80 MHz Bandwidth, Dual IF Receiver

More results

유사한 설명 - AD6673BCPZ-250

제조업체	부품명	데이터시트	상세설명
Analog Devices	AD6673	1Mb / 46P	80 MHz Bandwidth, Dual IF Receiver
Analog Devices	AD6677	1Mb / 48P	80 MHz Bandwidth, IF Receiver
Integrated Circuit Syst...	SF0199CD02382S	147Kb / 4P	199 MHz Filter 0.200 MHz Bandwidth for GSM BTS Receiver IF
API Technologies Corp	SF0199CD02382S	151Kb / 4P	199 MHz Filter 0.200 MHz Bandwidth for GSM BTS Receiver IF
Integrated Circuit Solu...	SF0199CD02382S	147Kb / 4P	199 MHz Filter 0.200 MHz Bandwidth for GSM BTS Receiver IF
Analog Devices	AD6642	1Mb / 33P	Dual IF Receiver
	AD6643	1Mb / 41P	Dual IF Receiver
	AD6642	1Mb / 32P	Dual IF Receiver REV. 0
	AD6659	1Mb / 40P	Dual IF Receiver REV. A
	AD6643	1Mb / 40P	Dual IF Receiver

More results

AD6673BCPZ-250 데이터시트(PDF) 11 Page - Analog Devices

AD6673BCPZ-250 데이터시트(HTML) 11 Page - Analog Devices

유사한 부품 번호 - AD6673BCPZ-250

유사한 설명 - AD6673BCPZ-250

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45

데이터시트 다운로드

링크 URL