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TPS56C20PWPR 데이터시트(PDF) 5 Page - Texas Instruments |
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TPS56C20PWPR 데이터시트(HTML) 5 Page - Texas Instruments |
5 / 44 page VIN VBST VFB GND VREG5 PGND 6 EN 5 1 3 SS 2 4 7 TPS56C20 HTSSOP 24 8 (PowerPAD) 9 10 A1 SCL SDA 15 16 VOUT PVIN PGOOD SW SW SW PGND PVIN A0 PGND 11 12 PGND 14 13 SW SW 17 18 19 24 20 21 22 23 5 TPS56C20, TPS56920, TPS56720, TPS56520 www.ti.com SLVSCB6D – NOVEMBER 2013 – REVISED FEBRUARY 2016 Product Folder Links: TPS56C20 TPS56920 TPS56720 TPS56520 Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated TPS56C20 24-Terminal PWP Package with PowerPAD (TOP VIEW) Terminal Functions TERMINAL I/O DESCRIPTION NAME NUMBER EN 1 I Enable. Pull High to enable according converter. SDA 2 I/O Data I/O terminal. SCL 3 I/O Clock I/O terminal. A1, A0 4,5 I Chip address. VIN 6 I Supply Input for 5.5V linear regulator. PVIN 7,8 I Power inputs and connects to both high side NFET drains. PGND 9,10,11,12 I/O Ground returns for low-side MOSFETs. Input of current comparator. SW 13,14,15, 16, 17 I/O Switch node connections for both the high-side NFETs and low-side NFETs. Input of current comparator. VBST 18 I Supply input for high-side NFET gate drive circuit. Connect 0.1µF ceramic capacitor between VBST and SW terminals. An internal diode is connected between VREG5 and VBST. PGOOD 19 O Open drain power good output. Low means the output voltage of the corresponding output is out of regulation. VREG5 20 O Output of 5.5V linear regulator. Bypass to GND with a high-quality ceramic capacitor of at least 3.0µF ceramic capacitor. Do not connect any other circuitry to the terminal. VREG5 is active when EN is H-level. GND 21 I/O Signal GND. Connect sensitive SS and VFB returns to GND at a single point. SS 22 O Soft-Start Programming terminal. Connect Capacitor from SS terminal to GND to program Soft- Start time. VOUT 23 I Connection to output voltage VFB 24 I D-CAP2 feedback inputs. Connect to output voltage with resistor divider. Exposed Thermal Pad Back side I/O Thermal pad of the package. Must be soldered to achieve appropriate dissipation. Must be connected to GND. |
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